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“砷化镓抛光液，西美半导体”参数说明
| 类型： | 砷化镓抛光液 | 材质： | 二氧化硅 |
| 适用范围： | 玻璃 | 加工定制： | 是 |
| pH (20℃）： | 10.0±0.5 |
“砷化镓抛光液，西美半导体”详细介绍
CM-S700主要由高纯度胶态二氧化硅组成，特别适用于2-6寸GaAs晶片的抛光，具有稳定性和分散性良好，去除率高、表面粗糙度小以及对工件无损伤等优点。即使在稀释倍率很高的情况下使用，仍具有很好的抛光效率和使用寿命。
CM-S700 is a colloidal silica slurry developed especially for polishing 2-6 inches GaAs wafer, with excellent particle stability and dispersal, it possesses a high removal rate, good surface effects and damage-free polishing. Even when used at high dilutions, CM-S700 delivers excellent processing efficiency and long slurry life.
型号Type
项目 Item 精抛 粗抛
SiO2含量Content of SiO2 (%) 15±2 35±2
pH (20℃) 10.0±0.5 10.0±0.5
比重 Specific gravity (20℃) 1.09±0.02 1.23±0.02
粘度 Viscosity (20℃，cps) ≤30 ≤18
碱游离度
Free Alkalinity as Na2O% m/m 平均粒径
Average Particle Size (nm) 15-25 40-50
杀菌剂含量
Biocide Content (ppm) 用途
Application 精抛
final polishing 粗抛
first polishing
包装 Package 5kg, 25kg, 260kg, 1T
符合RoHS标准 RoHS compliant
CM-S700 is a colloidal silica slurry developed especially for polishing 2-6 inches GaAs wafer, with excellent particle stability and dispersal, it possesses a high removal rate, good surface effects and damage-free polishing. Even when used at high dilutions, CM-S700 delivers excellent processing efficiency and long slurry life.
型号Type
项目 Item 精抛 粗抛
SiO2含量Content of SiO2 (%) 15±2 35±2
pH (20℃) 10.0±0.5 10.0±0.5
比重 Specific gravity (20℃) 1.09±0.02 1.23±0.02
粘度 Viscosity (20℃，cps) ≤30 ≤18
碱游离度
Free Alkalinity as Na2O% m/m 平均粒径
Average Particle Size (nm) 15-25 40-50
杀菌剂含量
Biocide Content (ppm) 用途
Application 精抛
final polishing 粗抛
first polishing
包装 Package 5kg, 25kg, 260kg, 1T
符合RoHS标准 RoHS compliant
